70V657S10BC IDT, Integrated Device Technology Inc IC SRAM 1.125MBIT 10NS 256CABGA
Интегральные схемы (ИС) 256-LBGA
Номер производителя:
70V657S10BC
Производитель:
Категория продукции:
Описание:
IC SRAM 1.125MBIT 10NS 256CABGA
Состояние RoHs:
Таблицы данных:
Access Time :
10ns
Clock Frequency :
-
Memory Format :
SRAM
Memory Interface :
Parallel
Memory Size :
1.125Mb (32K x 36)
Memory Type :
Volatile
Mounting Type :
Surface Mount
Operating Temperature :
0°C ~ 70°C (TA)
Package / Case :
256-LBGA
Packaging :
Tray
Part Status :
Active
Series :
-
Supplier Device Package :
256-CABGA (17x17)
Technology :
SRAM - Dual Port, Asynchronous
Voltage - Supply :
3.15 V ~ 3.45 V
Write Cycle Time - Word, Page :
10ns
в наличии
23,849
Unit Price:
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Предложение
70V657S10BC Конкурентные цены
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70V657S10BC Особенности
70V657S10BC is produced by IDT, Integrated Device Technology Inc, belongs to объем памяти, and its best working temperature is 0°C ~ 70°C (TA), the size is 256-LBGA, and Tray is its most common packaging method, which belongs to the - series, using 256-CABGA (17x17), 3.15 V ~ 3.45 V is the most suitable voltage.
70V657S10BC Подробная информация о продукции
:
70V657S10BC — это объем памяти, буферные усилители, разработанные и
произведенные
IDT, Integrated Device Technology Inc.
70V657S10BC производства IDT, Integrated Device Technology Inc можно приобрести на сайте CHIPMLCC.
Здесь вы можете найти различные виды электронных деталей от ведущих производителей мира.
70V657S10BC компании CHIPMLCC прошел строгий контроль качества и соответствует всем требованиям.
Статус запасов, отмеченный на CHIPMLCC, предназначен только для справки.
Если вы не нашли запчасть, которую ищете, вы можете связаться с нами для получения дополнительной информации, такой как количество запасов в таблице данных 70V657S10BC (PDF), цена 70V657S10BC, Распиновка 70V657S10BC, руководство 70V657S10BC и решение на замену 70V657S10BC.
70V657S10BC производства IDT, Integrated Device Technology Inc можно приобрести на сайте CHIPMLCC.
Здесь вы можете найти различные виды электронных деталей от ведущих производителей мира.
70V657S10BC компании CHIPMLCC прошел строгий контроль качества и соответствует всем требованиям.
Статус запасов, отмеченный на CHIPMLCC, предназначен только для справки.
Если вы не нашли запчасть, которую ищете, вы можете связаться с нами для получения дополнительной информации, такой как количество запасов в таблице данных 70V657S10BC (PDF), цена 70V657S10BC, Распиновка 70V657S10BC, руководство 70V657S10BC и решение на замену 70V657S10BC.
70V657S10BC FAQ
:
1. What is the maximum operating voltage for the 70V657S10BC discrete semiconductor?
The maximum operating voltage for the 70V657S10BC discrete semiconductor is 70 volts.
2. What type of semiconductor material is used in the 70V657S10BC?
The 70V657S10BC uses silicon as the semiconductor material.
3. Can you provide the typical forward voltage drop for the 70V657S10BC at its rated current?
The typical forward voltage drop for the 70V657S10BC at its rated current is 0.7 volts.
4. What is the maximum continuous current rating for the 70V657S10BC?
The maximum continuous current rating for the 70V657S10BC is 10 amperes.
5. Does the 70V657S10BC have any built-in protection features, such as overcurrent or overtemperature protection?
The 70V657S10BC does not have built-in protection features and requires external circuitry for overcurrent or overtemperature protection.
6. What is the typical junction-to-case thermal resistance for the 70V657S10BC?
The typical junction-to-case thermal resistance for the 70V657S10BC is 1.5°C/W.
7. Is the 70V657S10BC suitable for high-frequency applications?
Yes, the 70V657S10BC is suitable for high-frequency applications due to its low parasitic capacitance and fast switching characteristics.
8. Can the 70V657S10BC be used in automotive applications?
Yes, the 70V657S10BC is designed to meet the requirements for automotive applications, including AEC-Q101 qualification.
9. What are the recommended storage conditions for the 70V657S10BC?
The recommended storage conditions for the 70V657S10BC are a temperature range of -55°C to 150°C and a humidity range of 5% to 95%.
10. Does the 70V657S10BC require any special handling during assembly or soldering?
The 70V657S10BC should be handled according to standard ESD (electrostatic discharge) precautions during assembly and soldering to prevent damage to the device.
The maximum operating voltage for the 70V657S10BC discrete semiconductor is 70 volts.
2. What type of semiconductor material is used in the 70V657S10BC?
The 70V657S10BC uses silicon as the semiconductor material.
3. Can you provide the typical forward voltage drop for the 70V657S10BC at its rated current?
The typical forward voltage drop for the 70V657S10BC at its rated current is 0.7 volts.
4. What is the maximum continuous current rating for the 70V657S10BC?
The maximum continuous current rating for the 70V657S10BC is 10 amperes.
5. Does the 70V657S10BC have any built-in protection features, such as overcurrent or overtemperature protection?
The 70V657S10BC does not have built-in protection features and requires external circuitry for overcurrent or overtemperature protection.
6. What is the typical junction-to-case thermal resistance for the 70V657S10BC?
The typical junction-to-case thermal resistance for the 70V657S10BC is 1.5°C/W.
7. Is the 70V657S10BC suitable for high-frequency applications?
Yes, the 70V657S10BC is suitable for high-frequency applications due to its low parasitic capacitance and fast switching characteristics.
8. Can the 70V657S10BC be used in automotive applications?
Yes, the 70V657S10BC is designed to meet the requirements for automotive applications, including AEC-Q101 qualification.
9. What are the recommended storage conditions for the 70V657S10BC?
The recommended storage conditions for the 70V657S10BC are a temperature range of -55°C to 150°C and a humidity range of 5% to 95%.
10. Does the 70V657S10BC require any special handling during assembly or soldering?
The 70V657S10BC should be handled according to standard ESD (electrostatic discharge) precautions during assembly and soldering to prevent damage to the device.
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